Catenaa, Saturday, January 17, 2026-China’s push for self-reliance in semiconductor equipment exceeded expectations in 2025, with domestic equipment now accounting for 35 percent of the country’s total, surpassing the 30 percent target set earlier in the year.
The figure rose from 25 percent in 2024, reflecting rapid adoption of local technology across critical manufacturing processes.
Key advances were seen in etching and thin-film deposition, where domestic equipment penetration surpassed 40 percent. Companies such as Advanced Micro-Fabrication Equipment and Naura Technology Group drove this growth.
Advanced Micro-Fabrication’s 5-nanometre-grade etching machine entered validation for Taiwan Semiconductor Manufacturing Co’s advanced lines, while Naura’s oxidation and diffusion furnaces supply over 60 percent of the 28nm production lines at Semiconductor Manufacturing International Corp, China’s largest foundry.
Piotech also expanded its presence in plasma-enhanced chemical vapour deposition equipment, doubling its share to 30 percent at Yangtze Memory Technology’s 3D NAND production lines. Orders for domestic equipment remain strong, with backlogs extending into the first quarter of 2027.
China is expected to maintain its position as the world’s largest semiconductor equipment market through 2027, supported by growing reliance on homegrown technology and government initiatives favoring local suppliers over foreign competitors.
